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Home/Chip Manufacturers
Semiconductors

Chip Manufacturers

40 semiconductor companies — fabless designers, foundries, IDMs, memory, EDA, and equipment makers — with HQ, category, and notable products.

Ambarellafabless· United States· est. 2004Edge-AI vision SoCs, automotive & security camerasAMDfabless· United States· est. 1969x86 CPUs (Ryzen/EPYC), Radeon GPUs, Instinct accelerators, FPGAs (Xilinx)Analog DevicesIDM· United States· est. 1965Data converters, amplifiers, RF, power (incl. Maxim, Linear)Apple (Silicon)fabless· United States· est. 2020M-series & A-series SoCs for Mac/iPhone/iPad (fabbed at TSMC)Applied Materialsequipment· United States· est. 1967Deposition, etch, ion implant & inspection fab equipmentArmIP· United Kingdom· est. 1990CPU/GPU IP cores (Cortex, Neoverse) licensed to chipmakersASMLequipment· Netherlands· est. 1984EUV & DUV lithography systems — sole EUV supplierBroadcomfabless· United States· est. 1991Networking ASICs, custom AI accelerators, RF, storage connectivityCadence Design SystemsEDA· United States· est. 1988EDA tools, IP, system design & analysisCerebras Systemsfabless· United States· est. 2015Wafer-scale AI accelerators (WSE)GlobalFoundriesfoundry· United States· est. 2009Contract fabrication (mature/specialty nodes, RF, automotive)Graphcorefabless· United Kingdom· est. 2016IPU AI acceleratorsGroqfabless· United States· est. 2016LPU inference accelerators for low-latency LLM servingInfineon TechnologiesIDM· Germany· est. 1999Power semiconductors, automotive, security ICs, microcontrollersIntelIDM· United States· est. 1968x86 CPUs (Core/Xeon), Arc GPUs, foundry services, Gaudi acceleratorsKioxiamemory· Japan· est. 2017NAND flash memory & SSDs (BiCS), invented NANDKLA Corporationequipment· United States· est. 1997Process control, inspection & metrology systemsLam Researchequipment· United States· est. 1980Etch & deposition equipment for wafer fabricationMarvell Technologyfabless· United States· est. 1995Data-center networking, custom silicon, storage, 5GMediaTekfabless· Taiwan· est. 1997Dimensity/Helio mobile SoCs, connectivity, smart-device chipsMicrochip TechnologyIDM· United States· est. 1989MCUs (PIC/AVR), analog, FPGAs, memoryMicron Technologymemory· United States· est. 1978DRAM, NAND, HBM, storage under Crucial brandNVIDIAfabless· United States· est. 1993GPUs, AI accelerators (H100/Blackwell), CUDA, networkingNXP Semiconductorsfabless· Netherlands· est. 2006Automotive, secure connectivity, edge processing, NFConsemiIDM· United States· est. 1999Power & sensing semiconductors, automotive, industrialQualcommfabless· United States· est. 1985Snapdragon SoCs, modems, RF front-end, automotive & IoTRenesas ElectronicsIDM· Japan· est. 2010Automotive MCUs/SoCs, analog, power, connectivitySambaNova Systemsfabless· United States· est. 2017Reconfigurable dataflow AI acceleratorsSamsung ElectronicsIDM· South Korea· est. 1969Memory (DRAM/NAND), foundry, Exynos SoCs, image sensorsSK Hynixmemory· South Korea· est. 1983DRAM, NAND flash, HBM (high-bandwidth memory for AI)SMICfoundry· China· est. 2000China's largest contract foundry (mature & advanced nodes)Sony SemiconductorIDM· Japan· est. 2016CMOS image sensors (market leader), sensingSTMicroelectronicsIDM· Switzerland· est. 1987MCUs (STM32), MEMS sensors, power, automotiveSynopsysEDA· United States· est. 1986EDA design tools, semiconductor IP, verificationTenstorrentfabless· Canada· est. 2016RISC-V AI accelerators & CPUsTexas InstrumentsIDM· United States· est. 1930Analog & embedded processing, power management, MCUsTokyo Electronequipment· Japan· est. 1963Coater/developer, etch, deposition fab equipmentTSMCfoundry· Taiwan· est. 1987Contract fabrication (3nm/5nm/7nm), advanced packaging (CoWoS)United Microelectronics (UMC)foundry· Taiwan· est. 1980Contract fabrication (specialty & mature nodes)Western Digitalmemory· United States· est. 1970NAND flash & storage (SanDisk), SSDs